Cobham Advanced Electronic Solutions - Electronic Manufacturing Services

Offering a full turnkey electronic manufacturing operation complete with testing and coating capabilities in a USA facility.

Electronic Manufacturing Services: Flexible Engagement Model

Cobham Semiconductor and Space Solutions has a flexible engagement model which aids our partner-customers with their Circuit Card Assembly requirements.

Circuit Card Assembly Services can assist with low-medium- high volume:

Circuit Card Assembly Services
  • Low volume process flow expertise
    • Build to print
    • Prototype
    • Engineering
    • Qualification
    • Quick turn
      • Typically less than 6 weeks turn from receipt of components and documentation
      • Non-Conformance MRT is typically via email
  • Material Procurement
    • Turnkey
    • Consignment
  • IC Screening and value added capabilities
    • PIND, RLAT, DPA, Fine and Gross Leak
    • Packaging, Electrical Testing, Tinning, Forming and Programming
  • CCA Production
    • Limited (Small Volume) Production
    • SMT, Through-hole, Test, Coat
    • MSFC/NASA 8739 and IPC-A-610/J-STD-001
    • LMSSC LAC and BSS SCGPMS processes
In House Radiation Test Capabilities

Cobham RAD Solutions has a flexible engagement model which aids our partner-customers with their Radiation Testing, Device Screening and Quick-Turn Prototype IC Assembly

  • In House Radiation Test Capabilities
    • MIL-STD DLA compliant radiation effects testing available for all DLC Radiation Test Methods
      • High dose rate (HDR), Low dose rate (LDR), ELDRS, Gamma source, SEE/SEL/SEFI/SET tests
    • We help clients turnkey services to characterize SEE with over 100+ man years in heavy ion, single event effect (SEE)
    • View out Class S Flow example to aid customers for screening and assembly services (attached flow and clean room)

Cobham Semiconductor and Space Solutions has various testing and packaging capabilities in our Colorado Springs and Plainview sites.

  • Customer furnished tooling
    • Cobham is experienced in integrating customer originated designs into a smooth, seamless high quality process
  • Full turnkey and “design to spec” services for hybrid, SMT assemblies and boxes
  • High reliability Chip on Board design and manufacturing services
  • RF/Microwave manufacturing services for high volume phased array antennas
  • Custom Packaging along with the commercially available plastic packaging Packages
    • Commercial Plastic Encapsulated Packages
    • Hermetic and Ceramic Flatpacks
    • Flip-Chip on -Flex
    • PCB
    • Ceramic
    • Chip-on-Board
    • Cantilever and Pyramid Stacked die
    • CCGA Solder Column attachment